18137684. IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Youngjae Choi of Suwon-si (KR)
IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18137684 titled 'IMAGE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The abstract describes an image sensor package with improved reliability and a method of fabricating the same. The package includes a package substrate, an image sensor chip with a pixel area and a peripheral area, a dam in the peripheral area, a transparent cover on the dam, and a sealing material covering the image sensor chip and side surfaces of the transparent cover.
- Package includes a dam with a rectangular ring shape surrounding the pixel area
- Transparent cover covers upper portion of image sensor chip
- Dam includes stress relaxation layer (SRL) and body layer with SRL having lower viscosity than body layer
- Potential Applications
- Consumer electronics such as smartphones, digital cameras, and tablets
- Automotive applications for cameras and sensors in vehicles
- Problems Solved
- Improved reliability of image sensor packages
- Protection of image sensor chip from external elements and damage
- Benefits
- Enhanced durability and longevity of image sensor packages
- Better performance and quality of images captured by image sensor chip
Original Abstract Submitted
Provided are an image sensor package with improved reliability and a method of fabricating the same. The image sensor package includes: a package substrate; an image sensor chip provided on the package substrate, and including a pixel area and a peripheral area surrounding the pixel area; a dam in the peripheral area, the dam having a rectangular ring shape and surrounding the pixel area; a transparent cover provided on the dam and covering an upper portion of the image sensor chip; and a sealing material sealing the image sensor chip and covering side surfaces of the transparent cover. The dam includes a stress relaxation layer (SRL) and a body layer on the SRL, and the SRL has a lower viscosity than a viscosity of the body layer.
