18137595. POWER MODULE FOR VEHICLE simplified abstract (KIA CORPORATION)
Contents
- 1 POWER MODULE FOR VEHICLE
POWER MODULE FOR VEHICLE
Organization Name
Inventor(s)
Jun Hee Park of Hwaseong-Si (KR)
Nam Sik Kong of Hwaseong-Si (KR)
POWER MODULE FOR VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18137595 titled 'POWER MODULE FOR VEHICLE
Simplified Explanation
The patent application describes a power module for a vehicle, consisting of two substrates with metal circuits and spacers, as well as a semiconductor chip with power and signal pads.
- First substrate with a metal circuit and spacer in one direction
- Second substrate facing the first substrate with a metal circuit and spacer in the opposite direction
- Semiconductor chip between the substrates with power and signal pads
- Spacers from each substrate connecting to the corresponding pads on the chip
Potential Applications
The technology can be applied in electric vehicles, hybrid vehicles, and other automotive systems requiring power modules for efficient operation.
Problems Solved
This innovation solves the problem of efficiently managing power distribution and signal transmission in a compact and reliable manner within a vehicle's power module.
Benefits
The benefits of this technology include improved power efficiency, space-saving design, and enhanced reliability in vehicle power systems.
Potential Commercial Applications
The technology can be commercially applied in the automotive industry for manufacturing power modules for electric and hybrid vehicles, as well as in other industries requiring similar power management solutions.
Possible Prior Art
One possible prior art could be power modules with similar substrate and spacer configurations used in electronic devices or industrial equipment.
Unanswered Questions
How does this technology compare to existing power module designs in terms of efficiency and reliability?
This article does not provide a direct comparison with existing power module designs in terms of efficiency and reliability. Further research or testing may be needed to determine the advantages of this technology over others.
What are the potential challenges in implementing this technology on a larger scale in automotive production?
The article does not address the potential challenges in scaling up the production of power modules using this technology in the automotive industry. Factors such as cost, compatibility with existing systems, and regulatory requirements could pose challenges that need to be explored further.
Original Abstract Submitted
A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.
