18135741. MICRO DISPLAY DEVICE simplified abstract (UNITED MICROELECTRONICS CORP.)
Contents
MICRO DISPLAY DEVICE
Organization Name
Inventor(s)
Chuan-Lan Lin of Chiayi City (TW)
Yu-Ping Wang of Hsinchu City (TW)
Chien-Ting Lin of Tainan City (TW)
Chu-Fu Lin of Kaohsiung City (TW)
Chun-Ting Yeh of Taipei City (TW)
Chung-Hsing Kuo of Taipei City (TW)
Yi-Feng Hsu of Hsinchu City (TW)
MICRO DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18135741 titled 'MICRO DISPLAY DEVICE
Simplified Explanation: The semiconductor device described in the patent application includes a substrate with a bonding area and a pad area, a first inter-metal dielectric (IMD) layer, a metal interconnection, a first pad on the bonding area connected to the metal interconnection, and a second pad on the pad area also connected to the metal interconnection.
Key Features and Innovation:
- Semiconductor device with specific pad configurations for improved connectivity.
- First pad with two portions for enhanced connection to the metal interconnection.
- Second pad with two portions for improved connection to the metal interconnection.
- Top surfaces of the second and fourth portions are coplanar for uniformity.
Potential Applications: The technology can be applied in various semiconductor devices requiring precise and reliable interconnections.
Problems Solved: This innovation addresses the need for efficient and stable connections in semiconductor devices.
Benefits:
- Enhanced connectivity and reliability in semiconductor devices.
- Improved performance due to optimized pad configurations.
Commercial Applications: This technology can be utilized in the manufacturing of advanced semiconductor devices for various industries, including electronics and telecommunications.
Prior Art: Readers can explore prior research on semiconductor device interconnections and pad configurations to understand the evolution of this technology.
Frequently Updated Research: Stay informed about the latest developments in semiconductor device interconnection technologies to remain at the forefront of innovation.
Questions about Semiconductor Device Interconnections: 1. What are the key advantages of the specific pad configurations described in the patent application? 2. How does this technology contribute to the overall performance and reliability of semiconductor devices?
Original Abstract Submitted
A semiconductor device includes a substrate having a bonding area and a pad area, a first inter-metal dielectric (IMD) layer on the substrate, a metal interconnection in the first IMD layer, a first pad on the bonding area and connected to the metal interconnection, and a second pad on the pad area and connected to the metal interconnection. Preferably, the first pad includes a first portion connecting the metal interconnection and a second portion on the first portion, and the second pad includes a third portion connecting the metal interconnection and a fourth portion on the third portion, in which top surfaces of the second portion and the fourth portion are coplanar.
