18134933. POWER MODULE simplified abstract (Kia Corporation)
Contents
POWER MODULE
Organization Name
Inventor(s)
Jin Myeong Yang of Seongnam-Si (KR)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134933 titled 'POWER MODULE
Simplified Explanation
The power module described in the patent application includes various components such as substrates, semiconductor chips, spacers, connection layers, and power leads. These components work together to create a power module with enhanced functionality and efficiency.
- Upper and lower substrates provide a structural foundation for the power module.
- Spacers are used to electrically connect different layers and components within the module.
- Connection layers with conductivity allow for the penetration of spacers and facilitate electrical connections.
- Power lead is a crucial component for transmitting power within the module.
Potential Applications
The technology described in this patent application could be used in various power electronics applications, such as inverters, converters, motor drives, and power supplies.
Problems Solved
This technology solves the problem of efficiently connecting different components within a power module while maintaining electrical conductivity and structural integrity.
Benefits
The benefits of this technology include improved efficiency, reliability, and performance of power modules in various applications.
Potential Commercial Applications
The technology described in this patent application could have commercial applications in industries such as automotive, renewable energy, industrial automation, and consumer electronics.
Possible Prior Art
One possible prior art for this technology could be similar power module designs with different configurations and materials used for substrates, spacers, and connection layers.
Unanswered Questions
How does this technology compare to existing power module designs in terms of efficiency and performance?
This article does not provide a direct comparison with existing power module designs to assess efficiency and performance.
What are the potential cost implications of implementing this technology in mass production?
The article does not address the potential cost implications of mass-producing power modules using this technology.
Original Abstract Submitted
A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.
