18134360. FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
Organization Name
Inventor(s)
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134360 titled 'FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
Simplified Explanation
The fingerprint sensor package described in the patent application includes:
- A first substrate with a core insulating layer, a through-hole, a first bonding pad, and an external connection pad.
- A second substrate with a sensing region, a peripheral region, and a second bonding pad.
- A controller chip and a molded layer covering the controller chip.
- Potential Applications:**
- Biometric security systems
- Access control systems
- Mobile device authentication
- Problems Solved:**
- Secure and accurate fingerprint recognition
- Integration of fingerprint sensor technology into various devices
- Protection of sensitive components within the sensor package
- Benefits:**
- Enhanced security measures
- Convenient and reliable authentication process
- Versatile applications in different industries and devices
Original Abstract Submitted
A fingerprint sensor package includes a first substrate including a core insulating layer including first and second surfaces opposing each other and having a through-hole penetrating through the first surface and the second surface, a first bonding pad along a circumference of the through-hole on the first or second surface, and an external connection pad on an edge of the second surface, a second substrate having a third surface including a sensing region and a peripheral region surrounding the sensing region, and a fourth surface opposing the third surface, the second substrate including a second bonding pad along an edge of the third or fourth surface and bonded to the first bonding pad, and covering the through-hole, a controller chip on the fourth surface, and a molded layer on the second surface of the core insulating layer, covering the controller chip, and spaced apart from the external connection pad.
