18131022. DIELECTRIC SLURRY COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT USING SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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DIELECTRIC SLURRY COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT USING SAME

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Tae Gyun Kwon of Suwon-si (KR)

So Hyeon Hong of Suwon-si (KR)

Eung Seok Lee of Suwon-si (KR)

DIELECTRIC SLURRY COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT USING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18131022 titled 'DIELECTRIC SLURRY COMPOSITION AND MULTILAYER ELECTRONIC COMPONENT USING SAME

Simplified Explanation

The abstract describes a dielectric slurry composition consisting of two solutions, one with hydrophobic solvent and dielectric particles, and the other with hydrophilic solvent, dispersant, and binder, where the first solution forms an emulsion structure in the second solution.

  • Explanation of the patent/innovation:
 * The composition includes a first solution with hydrophobic solvent and dielectric particles.
 * A second solution contains hydrophilic solvent, dispersant, and binder.
 * The first solution forms an emulsion structure in the second solution.

Potential Applications

The dielectric slurry composition could be used in:

  • Electronic components manufacturing
  • Energy storage devices
  • Insulation materials

Problems Solved

This technology helps in:

  • Enhancing dielectric properties
  • Improving dispersion of particles
  • Facilitating the manufacturing process

Benefits

The benefits of this technology include:

  • Increased efficiency in electronic devices
  • Improved performance of energy storage systems
  • Enhanced insulation properties

Potential Commercial Applications

The dielectric slurry composition could find applications in:

  • Electronics industry
  • Energy storage sector
  • Insulation material manufacturing

Possible Prior Art

There may be prior art related to:

  • Dielectric materials
  • Slurry compositions for electronic applications

Unanswered Questions

How does this composition compare to traditional dielectric materials in terms of performance and cost?

This article does not provide a direct comparison between the new composition and traditional dielectric materials. Further research or testing may be needed to determine the performance and cost differences.

What are the specific types of electronic components that could benefit the most from using this dielectric slurry composition?

The article does not specify the types of electronic components that could benefit the most from this composition. Additional studies or experiments could help identify the most suitable applications.


Original Abstract Submitted

A dielectric slurry composition according to an embodiment of the present disclosure includes: a first solution including a hydrophobic solvent and dielectric particles; and a second solution containing a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder, wherein at least a portion of the first solution has an emulsion structure in the second solution.