18131019. CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18131019 titled 'CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
The abstract of the patent application describes a circuit board with a unique design featuring a conductive pad that protrudes above the surface of the insulating layers, one of which includes a reinforcing material. The conductive pad has a curved shape at one corner.
- The circuit board includes a first insulating layer without a reinforcing material.
- A conductive pad protrudes above the surface of the first insulating layer.
- A second insulating layer beneath the first layer contains a reinforcing material.
- The corner of the conductive pad has a curved shape.
Potential Applications: - Electronics manufacturing - Printed circuit board (PCB) design - Consumer electronics
Problems Solved: - Enhanced durability and strength of the circuit board - Improved electrical conductivity - Space-saving design
Benefits: - Increased reliability of electronic devices - Cost-effective manufacturing process - Compact and efficient circuit board design
Commercial Applications: Title: Innovative Circuit Board Design for Enhanced Performance This technology can be utilized in various industries such as telecommunications, automotive, and aerospace for improved electronic systems.
Questions about the technology: 1. How does the curved shape of the conductive pad impact the overall performance of the circuit board? 2. What are the specific advantages of using a reinforcing material in the second insulating layer?
Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing techniques to further enhance the performance and efficiency of circuit boards. Stay updated on the latest advancements in the field for potential future applications.
Original Abstract Submitted
A circuit board according to an embodiment includes: a first insulating layer that does not include a reinforcing material; a conductive pad that protrudes above a surface of the first insulating layer, and a second insulating layer that is disposed below the first insulating layer and includes a reinforcing material. A corner of the conductive pad has a curved shape.
