18130965. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Jin Hyung Lim of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18130965 titled 'MULTILAYER ELECTRONIC COMPONENT
The abstract describes a multilayer electronic component with a dielectric layer and internal electrodes, as well as an external electrode with a base electrode layer, a thin film electrode layer, and a plating layer.
- The body of the component includes a dielectric layer and internal electrodes.
- The external electrode consists of a base electrode layer connected to the internal electrode, a thin film electrode layer on top of the base electrode layer, and a plating layer on the thin film electrode layer.
- The average thickness of the base electrode layer is between 1 μm and 3 μm, while the thin film electrode layer is between 300 nm and 800 nm.
Potential Applications: - This technology can be used in various electronic devices such as capacitors, sensors, and filters. - It can also be applied in telecommunications equipment, medical devices, and automotive electronics.
Problems Solved: - Provides a compact and efficient solution for electronic components. - Enhances the performance and reliability of electronic devices.
Benefits: - Improved functionality and durability of electronic components. - Enables miniaturization of devices without compromising performance.
Commercial Applications: - This technology can be utilized in the manufacturing of consumer electronics, industrial equipment, and aerospace systems, among others.
Questions about Multilayer Electronic Component: 1. How does the thickness of the base electrode layer impact the performance of the component? 2. What are the advantages of using a plating layer on the thin film electrode layer?
Frequently Updated Research: - Stay updated on advancements in multilayer electronic components and related technologies to ensure optimal performance and efficiency in electronic devices.
Original Abstract Submitted
A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode including a base electrode layer connected to the internal electrode, a thin film electrode layer disposed on the base electrode layer, and a plating layer disposed on the thin film electrode layer, wherein an average thickness of the base electrode layer may be 1 μm or more and 3 μm or less, and an average thickness of the thin film electrode layer may be 300 nm or more and 800 nm or less.
