18130719. HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME simplified abstract (TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.)
Contents
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME
Organization Name
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Inventor(s)
Feng Zhou of Ann Arbor MI (US)
Tianzhu Fan of Houston TX (US)
Ercan Mehmet Dede of Ann Arbor MI (US)
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18130719 titled 'HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME
The method described in the patent application involves manufacturing highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies in high volume. This process includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates to form an IPEs embedded PCB-cold plate fabrication panel. The final step involves cutting the panel into multiple highly integrated power electronics embedded PCB-cold plate assemblies.
- Bonding a power device fabrication panel to a multi-layer PCB
- Drilling via passageways in the multi-layer PCB
- Electroplating a conductive metal into the vias
- Bonding the power device fabrication panel to a plurality of cold plates
- Cutting the panel into highly integrated power electronics embedded PCB-cold plate assemblies
Potential Applications: - Power electronics manufacturing - Automotive industry for electric vehicles - Renewable energy systems
Problems Solved: - Streamlining the manufacturing process of power electronics embedded PCB-cold plate assemblies - Increasing efficiency and volume of production - Enhancing integration and performance of power electronics systems
Benefits: - Cost-effective manufacturing process - Improved thermal management - Higher integration levels for power electronics systems
Commercial Applications: Title: "High Volume Manufacture of Highly Integrated Power Electronics Embedded PCB-Cold Plate Assemblies" This technology can be utilized in industries such as automotive, renewable energy, consumer electronics, and industrial automation for efficient and high-performance power electronics systems.
Questions about High Volume Manufacture of Highly Integrated Power Electronics Embedded PCB-Cold Plate Assemblies: 1. How does this method improve the integration of power electronics systems? 2. What are the potential cost savings associated with this manufacturing process?
Frequently Updated Research: Research on advancements in power electronics integration and thermal management techniques can provide valuable insights into further improving this manufacturing method.
Original Abstract Submitted
A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates and forming an IPEs embedded PCB-cold plate fabrication panel. The method also includes cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies.
