18127808. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Da Mi Kim of Suwon-si (KR)

Bum Suk Kang of Suwon-si (KR)

Su Jin Lee of Suwon-si (KR)

Dae Woo Yoon of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18127808 titled 'MULTILAYER ELECTRONIC COMPONENT

The abstract describes a multilayer electronic component with internal electrodes and a dielectric layer, as well as external electrodes connected to the internal electrodes. One of the internal electrodes includes an interfacial layer containing an oxide with Fe.

  • Body with dielectric layer and internal electrodes
  • External electrodes connected to internal electrodes
  • Internal electrode with interfacial layer containing Fe oxide

Potential Applications: - Electronic circuitry - Capacitors - Integrated circuits

Problems Solved: - Improved electrical conductivity - Enhanced component durability

Benefits: - Increased component efficiency - Greater reliability in electronic devices

Commercial Applications: Title: Advanced Multilayer Electronic Components for Enhanced Circuit Performance This technology can be used in various electronic devices, such as smartphones, computers, and automotive systems, to improve overall performance and reliability.

Questions about Multilayer Electronic Components: 1. How does the interfacial layer with Fe oxide enhance the performance of the electronic component? - The Fe oxide in the interfacial layer improves electrical conductivity and component durability.

2. What are the key differences between traditional electronic components and the multilayer electronic component described in the abstract? - The multilayer electronic component offers improved efficiency and reliability compared to traditional components.


Original Abstract Submitted

A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.