18125435. SUBSTRATE PROCESSING TUBE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
SUBSTRATE PROCESSING TUBE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE APPARATUS
Organization Name
Inventor(s)
BYEONGHOON Kim of Suwon-si (KR)
HYOUNCHEOL Kim of Suwon-si (KR)
BYUNGHWAN Kong of Suwon-si (KR)
SUBSTRATE PROCESSING TUBE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18125435 titled 'SUBSTRATE PROCESSING TUBE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE APPARATUS
Simplified Explanation
The patent application describes a substrate processing apparatus consisting of an inner tube, an outer tube, a gas supply conduit, and a boat. The inner tube provides a vertical process space, which is enclosed by the outer tube. The gas supply conduit is connected to the process space, and the boat is designed to be placed within the process space. The inner tube has different inner diameters at different positions, with the second position being at a higher level than the first position.
- The substrate processing apparatus consists of an inner tube, outer tube, gas supply conduit, and boat.
- The inner tube provides a vertical process space, enclosed by the outer tube.
- The gas supply conduit is connected to the process space.
- The boat is designed to be placed within the process space.
- The inner tube has different inner diameters at different positions.
- The second position is at a higher level than the first position.
Potential applications of this technology:
- Semiconductor manufacturing: The substrate processing apparatus can be used in the production of semiconductors, where precise and controlled processing of substrates is required.
- Thin film deposition: The apparatus can be utilized for depositing thin films on substrates, which is essential in various industries such as electronics and optics.
- Surface treatment: The technology can be employed for surface treatment processes like etching or cleaning, where uniform and efficient processing is necessary.
Problems solved by this technology:
- Uneven processing: The varying inner diameters of the inner tube ensure that the process space provides consistent and uniform processing, preventing uneven treatment of substrates.
- Space optimization: The vertical design of the apparatus allows for efficient use of space, making it suitable for compact manufacturing environments.
- Gas supply control: The gas supply conduit enables precise control over the gas flow and distribution within the process space, ensuring accurate processing conditions.
Benefits of this technology:
- Improved process uniformity: The apparatus's design helps achieve consistent processing results across substrates, enhancing product quality and yield.
- Space efficiency: The vertical configuration of the apparatus optimizes the use of available space, making it suitable for manufacturing facilities with limited area.
- Enhanced process control: The gas supply conduit enables precise control over the gas flow, facilitating accurate and controlled processing conditions.
Original Abstract Submitted
A substrate processing apparatus may include an inner tube providing a process space extending vertically, an outer tube enclosing the inner tube, a gas supplying conduit connected to the process space, and a boat configured to be disposed in the process space. A first inner diameter of the inner tube at a first position may be different from a second inner diameter of the inner tube at a second position, and a level of the second position may be higher than a level of the first position.
