18123187. ELECTROMAGNETIC BANDGAP STRUCTURE simplified abstract (Huawei Technologies Co., Ltd.)
Contents
ELECTROMAGNETIC BANDGAP STRUCTURE
Organization Name
Inventor(s)
Jamal Mohamed Ahmouda Zaid of Ottawa (CA)
ELECTROMAGNETIC BANDGAP STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18123187 titled 'ELECTROMAGNETIC BANDGAP STRUCTURE
The patent application describes an array with an electromagnetic bandgap structure that suppresses surface waves traveling across conductive patches on a dielectric substrate.
- The array includes multiple conductive patches, with a first and second patch that are electromagnetically coupled and shaped as polygons with at least three corners.
- The second conductive patch is spaced from the first patch to effectively suppress surface waves.
- The innovative design of the array helps in reducing interference and improving signal quality in electronic devices.
Potential Applications:
- Antennas
- Wireless communication systems
- Radar systems
Problems Solved:
- Interference from surface waves
- Signal degradation in electronic devices
Benefits:
- Improved signal quality
- Enhanced performance of electronic devices
Commercial Applications:
- Telecommunications industry
- Aerospace and defense sector
- Consumer electronics market
Questions about the technology: 1. How does the array effectively suppress surface waves? 2. What are the specific advantages of using the electromagnetic bandgap structure in electronic devices?
Frequently Updated Research: Researchers are continually exploring new materials and designs to further enhance the performance of electromagnetic bandgap structures in various applications.
Original Abstract Submitted
An array includes an electromagnetic bandgap structure having a dielectric substrate and multiple conductive patches on the dielectric substrate and for suppressing surface waves travelling across the conductive patches. The conductive patches include a first conductive patch and a second conductive patch spaced from, and electromagnetically coupled to, the first conductive patch. The second conductive patch is shaped as a polygon comprising at least three corners.