18120346. OPTOELECTRONIC PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
Contents
OPTOELECTRONIC PACKAGE STRUCTURE
Organization Name
Advanced Semiconductor Engineering, Inc.
Inventor(s)
Wen Chieh Yang of Kaohsiung (TW)
OPTOELECTRONIC PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18120346 titled 'OPTOELECTRONIC PACKAGE STRUCTURE
The abstract describes an optoelectronic package structure consisting of two photonic components and an interposer that optically connects them.
- The first photonic component is positioned above the second photonic component.
- The interposer acts as a bridge between the two components, defining a signal path between them.
- The interposer is configured to facilitate optical coupling between the photonic components.
Potential Applications: - Data communication systems - Optical networking equipment - High-speed computing devices
Problems Solved: - Enhances optical connectivity between photonic components - Improves signal transmission efficiency
Benefits: - Increased data transfer speeds - Enhanced performance of optoelectronic devices - Improved reliability of optical systems
Commercial Applications: Optical communication equipment manufacturers can utilize this technology to enhance the performance and reliability of their products, catering to the growing demand for high-speed data transmission solutions.
Questions about the technology: 1. How does the interposer improve optical coupling between the photonic components? 2. What are the potential limitations of this optoelectronic package structure in real-world applications?
Original Abstract Submitted
An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween.
