18119076. Semiconductor Device Testing with Lead Extender simplified abstract (Infineon Technologies AG)
Contents
Semiconductor Device Testing with Lead Extender
Organization Name
Inventor(s)
Semiconductor Device Testing with Lead Extender - A simplified explanation of the abstract
This abstract first appeared for US patent application 18119076 titled 'Semiconductor Device Testing with Lead Extender
The method described in the abstract involves testing a semiconductor package using a specialized apparatus.
- The method starts with providing a semiconductor package with leads protruding from an encapsulant body.
- A semiconductor device testing apparatus is then used, which includes a package holder, contact test probes, and a lead extender.
- The semiconductor package is arranged within the package holder, and the testing apparatus is actuated to make contact with the leads.
- Test current is applied to the semiconductor package through the contact test probes and the lead extender to assess its functionality.
Potential Applications: - Quality control in semiconductor manufacturing - Testing the reliability of semiconductor packages before deployment in electronic devices
Problems Solved: - Ensuring the functionality and reliability of semiconductor packages - Streamlining the testing process for semiconductor devices
Benefits: - Improved quality control in semiconductor manufacturing - Enhanced reliability of semiconductor packages - Efficient testing process for semiconductor devices
Commercial Applications: Title: Semiconductor Package Testing Method for Quality Control in Manufacturing This technology can be used in semiconductor manufacturing facilities to ensure the quality and reliability of semiconductor packages before they are integrated into electronic devices. By streamlining the testing process, companies can improve their overall product quality and reduce the risk of faulty components reaching the market.
Questions about Semiconductor Package Testing Method: 1. How does this method improve the quality control process in semiconductor manufacturing? - This method allows for thorough testing of semiconductor packages to ensure their functionality and reliability before they are used in electronic devices. 2. What are the potential applications of this technology beyond semiconductor manufacturing? - This technology can also be applied in other industries that require precise testing of electronic components for quality control purposes.
Original Abstract Submitted
A method includes providing a semiconductor package comprising an encapsulant body and a plurality of leads that protrude out from the encapsulant body, providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender, arranging the semiconductor package within the package holder, actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender, and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.
