18118736. ELECTRONIC PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
Contents
ELECTRONIC PACKAGE STRUCTURE
Organization Name
Advanced Semiconductor Engineering, Inc.
Inventor(s)
An-Hsuan Hsu of Kaohsiung (TW)
ELECTRONIC PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18118736 titled 'ELECTRONIC PACKAGE STRUCTURE
The abstract describes an electronic package structure with two thermal conductive structures and an electronic component. The first thermal conductive structure is placed over the electronic component, while the second thermal conductive structure is positioned between the electronic component and the first thermal conductive structure. The second thermal conductive structure has different heat transfer rates in different directions.
- The electronic package structure includes two thermal conductive structures and an electronic component.
- The first thermal conductive structure is placed over the electronic component.
- The second thermal conductive structure is positioned between the electronic component and the first thermal conductive structure.
- The second thermal conductive structure has different heat transfer rates in different directions.
- The first heat transfer rate from the electronic component to the first thermal conductive structure is greater than the second heat transfer rate in a direction nonparallel to the first.
Potential Applications: - Electronic devices requiring efficient heat dissipation - High-performance computing systems - Automotive electronics
Problems Solved: - Improved thermal management in electronic devices - Enhanced performance and reliability of electronic components
Benefits: - Increased efficiency in heat dissipation - Extended lifespan of electronic components - Enhanced overall performance of electronic devices
Commercial Applications: Title: Advanced Thermal Management System for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and telecommunications. It can improve the reliability and performance of electronic devices, leading to better user experience and reduced maintenance costs.
Questions about the technology: 1. How does the second thermal conductive structure improve heat transfer rates in different directions? 2. What are the specific benefits of using this electronic package structure in high-performance computing systems?
Original Abstract Submitted
An electronic package structure includes a first electronic component, a first thermal conductive structure and a second thermal conductive structure. The first thermal conductive structure is disposed over the first electronic component. The second thermal conductive structure is disposed between the first electronic component and the first thermal conductive structure. A first heat transfer rate of the second thermal conductive structure along a first direction from the first electronic component to the first thermal conductive structure is greater than a second heat transfer rate of the second thermal conductive structure along a second direction nonparallel with the first direction from the first electronic component to an element other than the first thermal conductive structure.
