18118725. ELECTRONIC DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
Contents
- 1 ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ELECTRONIC DEVICE
Organization Name
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Inventor(s)
Nobuhiro Yamamoto of Yokohama (JP)
Masahide Takazawa of Hachioji Tokyo (JP)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18118725 titled 'ELECTRONIC DEVICE
Simplified Explanation
The patent application describes an electronic device with a substrate that has an opening penetrating an organic compound layer, connecting to wiring and pads on the surface.
- The electronic device includes a substrate with an opening that penetrates an organic compound layer.
- The substrate has first and second surfaces, with wiring and pads connected to the surfaces.
- The opening allows access to both surfaces of the organic compound layer.
Potential Applications
This technology could be applied in the development of advanced electronic devices, such as flexible displays or sensors.
Problems Solved
This technology solves the problem of efficiently connecting wiring and pads to an organic compound layer in electronic devices.
Benefits
The benefits of this technology include improved functionality and reliability of electronic devices, as well as potential cost savings in manufacturing processes.
Potential Commercial Applications
"Enhancing Electronic Devices with Substrate Opening for Improved Connectivity"
Possible Prior Art
There may be prior art related to the integration of wiring and pads on electronic device substrates, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology impact the overall performance of electronic devices?
The patent application does not provide specific details on how the described technology may affect the performance metrics of electronic devices.
Are there any limitations or constraints associated with implementing this technology in practical applications?
The patent application does not address any potential limitations or constraints that may arise when implementing this technology in real-world electronic devices.
Original Abstract Submitted
According to one embodiment, an electronic device includes a wall and a substrate. The substrate is provided with an opening. The substrate includes an organic compound layer, a first surface of the organic compound layer, a second surface of the organic compound layer opposite the first surface, first wiring on the second surface, second wiring on the second surface, a first pad, and a second pad. The first surface is attached to the wall. The first pad is connected to the first wiring. The second pad is connected to the second wiring away from the first pad. The opening penetrates the organic compound layer to open to the first surface and the second surface between the first pad and the second pad.
