18114394. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
- 1 MULTILAYER ELECTRONIC COMPONENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing multilayer capacitor designs in terms of performance and efficiency?
- 1.11 What manufacturing processes are required to produce this multilayer electronic component, and how cost-effective are they?
- 1.12 Original Abstract Submitted
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Hoe Chul Jung of Suwon-si (KR)
Yun Sung Kang of Suwon-si (KR)
Byeong Gyu Park of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18114394 titled 'MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation
The multilayer electronic component described in the abstract consists of a body with a capacitance formation portion and a cover portion. The capacitance formation portion includes dielectric layers and internal electrodes alternately disposed in a first direction, while the cover portion is positioned on both end surfaces of the capacitance formation portion. The internal electrodes and dielectric layers protrude more outwardly than the cover portion in a second direction, and a groove is located at an end of the dielectric layer in the second direction.
- Body with capacitance formation portion and cover portion
- Internal electrodes and dielectric layers in first direction
- Cover portion with multiple surfaces in different directions
- External electrodes on third and fourth surfaces
- Groove at end of dielectric layer in second direction
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring compact and efficient multilayer capacitors, such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently integrating multiple layers of internal electrodes and dielectric layers in a compact electronic component, allowing for improved performance and space-saving design.
Benefits
The benefits of this technology include increased capacitance in a smaller footprint, improved efficiency in electronic devices, and enhanced overall performance due to the optimized design of the multilayer electronic component.
Potential Commercial Applications
- "Compact Multilayer Electronic Component for Enhanced Performance in Consumer Electronics"
Possible Prior Art
One possible prior art for this technology could be the development of multilayer ceramic capacitors with similar design features, but without the specific configuration of internal electrodes and dielectric layers as described in this patent application.
Unanswered Questions
How does this technology compare to existing multilayer capacitor designs in terms of performance and efficiency?
This article does not provide a direct comparison with existing multilayer capacitor designs, so it is unclear how this technology stacks up against current solutions in the market.
What manufacturing processes are required to produce this multilayer electronic component, and how cost-effective are they?
The article does not delve into the specific manufacturing processes or cost-effectiveness of producing this technology, leaving a gap in understanding the practical implementation and economic viability of the innovation.
Original Abstract Submitted
A multilayer electronic component includes a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion, facing each other in the first direction, and having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and external electrodes disposed on the third and fourth surfaces. The internal electrodes and the dielectric layers protrude more outwardly than the cover portion in the second direction, and a groove is disposed at an end of the dielectric layer in the second direction.
