18112120. METHODS FOR RETAINING A PROCESSING LIQUID ON A SURFACE OF A SEMICONDUCTOR SUBSTRATE simplified abstract (Tokyo Electron Limited)
Contents
METHODS FOR RETAINING A PROCESSING LIQUID ON A SURFACE OF A SEMICONDUCTOR SUBSTRATE
Organization Name
Inventor(s)
Peter D'elia of Albany NY (US)
METHODS FOR RETAINING A PROCESSING LIQUID ON A SURFACE OF A SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18112120 titled 'METHODS FOR RETAINING A PROCESSING LIQUID ON A SURFACE OF A SEMICONDUCTOR SUBSTRATE
Simplified Explanation: This patent application discusses improved methods for retaining a processing liquid on a semiconductor substrate by using a thin film to keep the liquid within the center region of the substrate.
- The patent application focuses on retaining a puddle within the center region of a semiconductor substrate.
- A thin film is deposited in the peripheral edge region of the substrate before dispensing the processing liquid in the center region.
- The thin film helps to prevent the liquid from spreading beyond the desired area on the substrate.
- This method is particularly useful when the substrate is stationary or rotating at low speeds.
Key Features and Innovation:
- Use of a thin film to retain a processing liquid within the center region of a semiconductor substrate.
- Prevents the liquid from spreading beyond the desired area on the substrate.
- Suitable for stationary substrates or those rotating at low speeds.
Potential Applications: This technology can be applied in semiconductor manufacturing processes where precise control of processing liquids is required. It can also be useful in research and development settings for experimental purposes.
Problems Solved: This technology addresses the issue of processing liquid spreading beyond the desired area on a semiconductor substrate, ensuring more precise and controlled application of the liquid.
Benefits:
- Improved accuracy and precision in applying processing liquids on semiconductor substrates.
- Enhanced control over the distribution of the liquid, leading to better overall results in semiconductor manufacturing processes.
Commercial Applications: Title: Enhanced Semiconductor Manufacturing Process Control This technology can be utilized in the semiconductor industry to improve the accuracy and efficiency of processing liquid application on substrates. It can lead to higher quality semiconductor products and potentially reduce manufacturing costs.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of semiconductor manufacturing processes, specifically focusing on methods for controlling processing liquids on substrates.
Frequently Updated Research: Researchers in the field of semiconductor manufacturing may be conducting ongoing studies to further optimize the use of thin films for retaining processing liquids on substrates. Stay updated on relevant publications and conferences for the latest advancements in this area.
Questions about Improved Puddle Processes: 1. What are the potential implications of this technology for the semiconductor industry? 2. How does the use of a thin film improve the control of processing liquids on semiconductor substrates?
Original Abstract Submitted
Improved puddle processes and methods are provided herein for retaining a processing liquid on a surface of a semiconductor substrate. More specifically, improved methods are provided herein for retaining a puddle within a center region of a semiconductor substrate while the substrate is stationary, or rotating at relatively low rotational speeds. In the disclosed embodiments, a puddle is retained within a center region of the semiconductor substrate by a thin film, which is deposited within a peripheral edge region of the substrate before a processing liquid is dispensed within the center region of the substrate to form the puddle.
