18111939. SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract (International Business Machines Corporation)

SOLDER VOLUME FOR FLIP-CHIP BONDING

Organization Name

International Business Machines Corporation

Inventor(s)

Toyohiro Aoki of Yokohama (JP)

Katsuyuki Sakuma of Fishkill NY (US)

Hiroyuki Mori of Yasu-shi (JP)

Koki Nakamura of Kawasaki (JP)

Takashi Hisada of Hachiouji-shi (JP)

SOLDER VOLUME FOR FLIP-CHIP BONDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18111939 titled 'SOLDER VOLUME FOR FLIP-CHIP BONDING

Simplified Explanation

The patent application describes methods, systems, and structures related to flip-chip bonding. It involves determining target solder volumes to be deposited on pads on a substrate, with variable volumes among the pads. Different thicknesses of resist are also determined to create solder resist openings that match the target solder volumes.

• Processor determines target solder volumes for pads on a substrate
• Variable solder volumes among the pads
• Different resist thicknesses create solder resist openings
• Sizes of openings comply with target solder volumes

Key Features and Innovation

• Determining variable target solder volumes for pads on a substrate
• Varying resist thicknesses to create solder resist openings that match the target solder volumes

Potential Applications

This technology can be applied in the manufacturing of electronic devices, specifically in the process of flip-chip bonding.

Problems Solved

This technology addresses the challenge of accurately depositing solder volumes on pads with varying requirements.

Benefits

• Improved accuracy in solder volume deposition
• Enhanced efficiency in flip-chip bonding processes

Commercial Applications

Title: Advanced Flip-Chip Bonding Technology for Electronic Manufacturing This technology can be utilized in the production of various electronic devices, such as smartphones, computers, and other consumer electronics. It can streamline the manufacturing process and improve the reliability of electronic components.

Prior Art

Readers interested in prior art related to flip-chip bonding technologies can explore research papers, patents, and industry publications on the topic.

Frequently Updated Research

Researchers in the field of microelectronics and semiconductor manufacturing may be conducting studies on advanced flip-chip bonding techniques and materials. Stay updated on relevant research to understand the latest developments in the field.

Questions about Flip-Chip Bonding

What are the key advantages of flip-chip bonding compared to other bonding techniques?

Flip-chip bonding offers superior electrical performance, shorter interconnection lengths, and better thermal management compared to wire bonding.

How does the variability in solder volumes among pads impact the overall performance of the electronic device?

The variability in solder volumes can affect the reliability and functionality of the electronic device, making it crucial to accurately deposit the solder volumes according to the specific requirements of each pad.

Original Abstract Submitted

Methods, systems, and structures relating to flip-chip bonding are described. A processor can determine a plurality of target solder volumes to be deposited on a plurality of pads on a surface of a substrate. The plurality of target solder volumes can be variable among the plurality of pads. The processor can determine different thicknesses of different portions of a layer of resist to be deposited across the surface of the substrate. The different thicknesses can define a plurality of solder resist openings having sizes that comply with the plurality of target solder volumes.