18099715. METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18099715 titled 'METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
Simplified Explanation
The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.
- The marking material used is a polymer compound with low light transmittance, making it suitable for laser sintering on semiconductor devices.
- The cured product formed by the marking material can act as a deflector to guide and control the flow rate of underfill, addressing the issue of uneven flow rate.
Potential Applications
The technology can be applied in semiconductor packaging processes to create marks on devices and control the flow of underfill.
Problems Solved
1. Uneven flow rate of underfill in semiconductor devices. 2. Difficulty in forming marks on semiconductor devices using laser sintering.
Benefits
1. Improved control over underfill flow rate. 2. Enhanced marking capabilities on semiconductor devices.
Potential Commercial Applications
"Polymer Compound Marking Method for Semiconductor Devices: Applications and Benefits"
Possible Prior Art
There may be prior art related to laser sintering of marking materials on semiconductor devices, but specific information is not provided in this disclosure.
Unanswered Questions
== How does the light transmittance of the marking material affect the laser sintering process? The abstract mentions that the light transmittance of the marking material is less than 50%, but it does not explain how this characteristic impacts the laser sintering process.
== What specific types of polymer compounds are suitable for forming the mark on semiconductor devices? The abstract mentions that the marking material is a polymer compound, but it does not specify which types of polymer compounds are most effective for this application.
Original Abstract Submitted
The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.
