18098987. SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Tzuan-Horng Liu of Hsinchu (TW)
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18098987 titled 'SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device package structure described in the abstract includes a redistribution structure, two semiconductor devices, a bridge die, conductive bumps, and solder material. The first semiconductor device is on one side of the redistribution structure, while the second semiconductor device and bridge die are on the opposite side. The conductive bumps and solder material facilitate electrical connections between the components.
- Redistribution structure with semiconductor devices and bridge die
- Conductive bumps for electrical connections
- Solder material for additional connections
Potential Applications
The technology described in this patent application could be used in various electronic devices that require efficient electrical connections between semiconductor components. Some potential applications include:
- Mobile phones
- Computers
- Automotive electronics
Problems Solved
This technology solves the problem of establishing reliable electrical connections between different semiconductor components in a compact package structure. By using conductive bumps and solder material, the components can be interconnected effectively.
Benefits
The benefits of this technology include:
- Improved electrical connectivity
- Compact package design
- Enhanced overall performance of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology include:
- Semiconductor manufacturing companies
- Electronics manufacturers
- Research institutions
Possible Prior Art
One possible prior art for this technology could be the use of wire bonding or flip-chip technology in semiconductor packaging. These methods have been commonly used to establish electrical connections in semiconductor devices.
Original Abstract Submitted
A semiconductor device package structure is provided, including a redistribution structure, a first semiconductor device, a second semiconductor device, a bridge die, a first conductive bump, and a second conductive bump bumps, a third conductive bumps, and a first solder material. The first semiconductor device is disposed on a first side of the redistribution structure, the second semiconductor device and the bridge die are disposed on a second side opposite to the first side. The first conductive bump is disposed on the first semiconductor device, the second conductive bump is disposed on the second side of the redistribution structure and the third conductive bump is disposed on the second semiconductor device. The first solder material is electrically connected between the second conductive bump and the third conductive bump, and the redistribution structure is electrically connected between the first conductive bump and the second conductive bump.
