18098979. SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract (Infineon Technologies AG)

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

Organization Name

Infineon Technologies AG

Inventor(s)

Mohd Afiz Hashim of Shah Alam (MY)

Zhi Yuan Goh of Bertam (MY)

Subaramaniym Senivasan of Bemban (MY)

Azmil Abdullah of Merlimau (MY)

Varun Parthasarathy of Johor Bahru (MY)

Kah Wai Lau of Duyung (MY)

Ahmad Zulkarnain Samsudin of Seremban (MY)

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18098979 titled 'SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

The semiconductor package described in the patent application consists of a substrate with a metallic surface, a semiconductor die bonded to the substrate with a solder joint, and a solder wetting structure welded to the metallic surface of the substrate outside the perimeter of the semiconductor die.

• The semiconductor die is metallurgically bonded to the metallic surface of the substrate by a first solder joint.
• A solder wetting structure is metallurgically welded to the metallic surface of the substrate outside the perimeter of the semiconductor die and adjacent to the side faces of the die.
• Excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure.
• The methods described in the patent application involve producing the semiconductor package and solder wetting structure.

Potential Applications: - This technology can be used in the manufacturing of various electronic devices such as smartphones, tablets, and computers. - It can also be applied in the automotive industry for electronic control units and sensors.

Problems Solved: - Ensures a strong metallurgical bond between the semiconductor die and the substrate. - Helps in managing excess solder during the bonding process.

Benefits: - Improved reliability and performance of electronic devices. - Enhanced thermal management due to efficient solder bonding.

Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in the production of consumer electronics, automotive electronics, and industrial control systems. It can lead to more reliable and efficient electronic devices, potentially increasing market competitiveness.

Questions about Semiconductor Packaging Technology: 1. How does the solder wetting structure contribute to the overall reliability of the semiconductor package? The solder wetting structure helps in managing excess solder and ensures a strong bond between the semiconductor die and the substrate, enhancing the overall reliability of the package.

2. What are the key differences between traditional semiconductor packaging methods and the approach described in the patent application? The patent application introduces a solder wetting structure outside the perimeter of the semiconductor die, providing a more controlled and efficient solder bonding process compared to traditional methods.

Original Abstract Submitted

A semiconductor package includes: a substrate having a metallic surface; a semiconductor die metallurgically bonded to the metallic surface of the substrate by a first solder joint; and a solder wetting structure metallurgically welded to the metallic surface of the substrate outside a perimeter of the semiconductor die and adjacent to one or more side faces of the semiconductor die. Excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure. Methods of producing the semiconductor package and solder wetting structure are also described.