18091943. EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (NVIDIA Corporation)

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EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

Organization Name

NVIDIA Corporation

Inventor(s)

Ronilo Boja of Santa Clara CA (US)

Padam Jain of Santa Clara CA (US)

EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18091943 titled 'EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

Simplified Explanation:

This patent application describes an integrated circuit package with a monolithic core and a device module embedded in a through-cavity.

  • The package substrate has a thickness between 800 to 2000 microns and a through-cavity passing through it.
  • The device module contains silicon-based passive or active device components.
  • The first module side of the device module aligns with the first substrate side, while the second module side aligns with the second substrate side.

Key Features and Innovation:

  • Monolithic core package substrate with a through-cavity for embedding a device module.
  • Device module includes silicon-based passive or active device components.
  • Precise alignment of the device module with the substrate sides.

Potential Applications:

  • Semiconductor industry for integrated circuit packaging.
  • Electronics manufacturing for compact and efficient devices.
  • Telecommunications for high-performance electronic components.

Problems Solved:

  • Enhanced integration of device components in a compact package.
  • Improved alignment and connectivity within the integrated circuit package.

Benefits:

  • Increased efficiency in electronic device manufacturing.
  • Compact design for space-saving applications.
  • Enhanced performance of integrated circuits.

Commercial Applications:

The technology can be utilized in the semiconductor industry for manufacturing high-performance integrated circuits, in electronics manufacturing for compact and efficient devices, and in telecommunications for advanced electronic components.

Questions about Integrated Circuit Package Technology:

1. How does the through-cavity design improve the integration of device components in the package? 2. What are the advantages of using silicon-based passive or active device components in the device module?


Original Abstract Submitted

An integrated circuit package including a package substrate including a monolithic core, the monolithic core having a first substrate side, a second substrate side opposite the first substrate side, a thickness in a range from 800 to 2000 microns and a through-cavity that passes through the first and second substrate sides. The package includes a device module, the device module having a first module side and a second module side opposite the first module side. The device module is embedded in the through-cavity, the first module side is aligned with the first substrate side, the second module side is aligned with the second substrate side, and the device module includes one or more silicon-based passive or silicon-based active device component. A method of manufacture of the integrated circuit package is also disclosed.

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