18091560. TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
Contents
TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18091560 titled 'TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE
Simplified Explanation: The patent application describes technologies for a vertically interconnected glass layer architecture, enabling three-dimensional heterogeneous integration for integrated circuit components.
- Glass layer architecture for integrated circuit components
- Allows for fine pitch connections between dies
- Enables three-dimensional heterogeneous integration
- Bridge die embedded in glass layer for interconnects
- Integrated circuit dies positioned above and below glass layer
Key Features and Innovation: - Vertically interconnected glass layer architecture - Three-dimensional heterogeneous integration - Fine pitch connections between dies - Bridge die embedded in glass layer for interconnects - Integrated circuit dies positioned above and below glass layer
Potential Applications: - Semiconductor industry - Electronics manufacturing - Advanced packaging technologies
Problems Solved: - Enable fine pitch connections between dies - Facilitate three-dimensional integration - Improve interconnectivity in integrated circuit components
Benefits: - Enhanced performance in integrated circuits - Increased efficiency in electronics manufacturing - Greater flexibility in design and layout
Commercial Applications: Title: Advanced Glass Layer Architecture for Integrated Circuits Potential commercial uses: Semiconductor manufacturing, electronics packaging, advanced technology development Market implications: Improved performance, efficiency, and design flexibility in integrated circuit components
Prior Art: Readers can start searching for prior art related to vertically interconnected glass layer architectures in the semiconductor industry, advanced packaging technologies, and three-dimensional integration methods.
Frequently Updated Research: Stay updated on the latest advancements in glass layer architecture for integrated circuits, three-dimensional integration technologies, and semiconductor packaging methods.
Questions about Glass Layer Architecture for Integrated Circuits: 1. What are the key benefits of vertically interconnected glass layer architectures in integrated circuits? - Vertically interconnected glass layer architectures offer enhanced performance, increased efficiency, and greater design flexibility in integrated circuit components.
2. How does the bridge die embedded in the glass layer facilitate interconnects between integrated circuit dies? - The bridge die embedded in the glass layer provides interconnects between the various dies and other components, enabling fine pitch connections and three-dimensional heterogeneous integration.
Original Abstract Submitted
Technologies for a vertically interconnected glass layer architecture is disclosed. In the illustrative embodiment, an integrated circuit component includes several integrated circuit dies and a glass layer. Integrated circuit dies are positioned both above and below the glass layer. The glass layer has a bridge die embedded in a cavity. The bridge die provides interconnects between the various dies and to other components off of the integrated circuit component. The glass layer can enable three-dimensional heterogeneous integration, allowing for fine pitch connections between dies.
