18091349. PACKAGE SUBSTRATE HAVING DEPRESSION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

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PACKAGE SUBSTRATE HAVING DEPRESSION

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

Michael Lueders of Freising (DE)

Giacomo Calabrese of Freising (DE)

Jonathan Almeria Noquil of Plano TX (US)

PACKAGE SUBSTRATE HAVING DEPRESSION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18091349 titled 'PACKAGE SUBSTRATE HAVING DEPRESSION

The abstract of the patent application describes a packaged integrated circuit (IC) with a package substrate containing metal interconnects surrounded by an insulation material, a depression region with a different material, a semiconductor die with circuitry, and a mold compound covering the die and depression region.

  • Package substrate with metal interconnects and insulation material
  • Depression region with different material
  • Semiconductor die with circuitry
  • Mold compound covering die and depression region

Potential Applications: - Consumer electronics - Automotive industry - Telecommunications

Problems Solved: - Enhanced circuit performance - Improved reliability - Increased durability

Benefits: - Higher functionality - Better thermal management - Cost-effective manufacturing

Commercial Applications: Title: "Innovative Packaging Solutions for Integrated Circuits" This technology can be used in various industries such as consumer electronics, automotive, and telecommunications, offering improved performance and reliability in electronic devices.

Questions about the technology: 1. How does the depression region with a different material enhance the performance of the integrated circuit? 

  - The depression region allows for better heat dissipation and electrical performance due to the unique material properties.

2. What are the potential challenges in implementing this packaging solution in mass production? 

  - Some challenges may include optimizing the manufacturing process and ensuring compatibility with existing assembly lines.


Original Abstract Submitted

In examples, a packaged integrated circuit (IC) comprises a package substrate having opposite first and second surfaces and including metal interconnects surrounded by an insulation material. The package substrate includes a depression region that extends from the first surface, and the depression region includes a material different from the insulation material and the metal interconnects. The packaged IC also comprises a semiconductor die on part of the first surface adjacent to the depression region. The semiconductor die includes circuitry coupled to the metal interconnects. The packaged IC also comprises a mold compound covering the semiconductor die and the depression region.

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