18091188. ELECTRICAL LAYER WITH ROUGHENED SURFACES simplified abstract (Intel Corporation)

ELECTRICAL LAYER WITH ROUGHENED SURFACES

Organization Name

Intel Corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ashay A. Dani of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Wei Wei of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

ELECTRICAL LAYER WITH ROUGHENED SURFACES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18091188 titled 'ELECTRICAL LAYER WITH ROUGHENED SURFACES

Simplified Explanation: The patent application discusses how roughened surfaces created through mechanical or chemical processes can be utilized to form coupling layers in electrical systems, ensuring robustness under high stress conditions.

Key Features and Innovation:

• Formation of roughened surfaces for coupling layers in electrical systems.
• Enhanced robustness of coupled components under high stress.
• Utilization in various applications such as dies, substrates, and computer chips.

Potential Applications: This technology can be applied in various industries such as electronics, automotive, aerospace, and manufacturing where robust coupling of components is essential.

Problems Solved: This technology addresses the challenge of maintaining strong connections between components in electrical systems when subjected to high stress conditions.

Benefits:

• Improved reliability and durability of electrical systems.
• Enhanced performance under high stress environments.
• Cost-effective solution for forming coupling layers in various applications.

Commercial Applications: The technology can be commercialized in the electronics industry for manufacturing computer chips, in the automotive sector for producing robust components, and in the aerospace industry for creating reliable substrates.

Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents in the field of surface engineering, materials science, and electrical coupling technologies.

Frequently Updated Research: Stay updated on advancements in surface engineering, materials science, and electrical coupling technologies to enhance the application and effectiveness of this innovation.

Questions about Roughened Surfaces for Coupling Layers in Electrical Systems: 1. What are the key benefits of using roughened surfaces for coupling layers in electrical systems? 2. How does this technology improve the reliability of electrical components under high stress conditions?

Original Abstract Submitted

Mechanical or chemical processes can form roughened surfaces which can be used for coupling layers of electrical systems such as when forming dies, substrates, computer chips or the like that, when subjected to high stress, are robust enough to remain coupled together.