18090922. SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Gregory Ostrowicki of Dallas TX (US)
Kashyap Mohan of Irving TX (US)
SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18090922 titled 'SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION
The semiconductor package described in the abstract includes a substrate with multiple conductive layers connected to bond pads, a semiconductor die with sensitive circuitry regions, conductive members in direct contact with specific circuitry regions, support members, a ring encircling bond pads, a glob top member, and a mold compound covering the package.
- The semiconductor package has a unique design to protect sensitive circuitry regions from mechanical or thermal stress.
- Conductive members are strategically placed to only make direct physical contact with less sensitive circuitry regions.
- Support members and a ring provide structural support and protection for the semiconductor die and bond pads.
- The glob top member and mold compound further safeguard the semiconductor die and substrate from external elements.
Potential Applications: - This technology can be used in various electronic devices where protection of sensitive circuitry is crucial. - It can be applied in industries requiring high reliability and durability in semiconductor packaging.
Problems Solved: - Addresses the issue of mechanical and thermal stress affecting sensitive circuitry regions in semiconductor packages. - Provides a solution for protecting delicate components in electronic devices.
Benefits: - Enhanced reliability and longevity of electronic devices. - Improved performance under challenging environmental conditions.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, aerospace applications, and industrial equipment where robust semiconductor packaging is essential for optimal performance and longevity.
Prior Art: Further research can be conducted in the field of semiconductor packaging technologies to explore similar innovations and advancements in protecting sensitive circuitry regions.
Frequently Updated Research: Stay updated on the latest developments in semiconductor packaging materials, design techniques, and reliability testing methods to enhance the performance and durability of electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does the placement of conductive members impact the protection of sensitive circuitry regions? - The placement of conductive members ensures that only less sensitive circuitry regions are in direct physical contact, reducing the risk of damage from external stressors. 2. What role do support members play in safeguarding the semiconductor die and substrate? - Support members provide structural support and prevent direct contact between the semiconductor die and the substrate, enhancing the overall durability of the package.
Original Abstract Submitted
In examples, a semiconductor package comprises a substrate having multiple conductive layers coupled to bond pads at a surface of the substrate. The package includes a semiconductor die including a device side facing the substrate, the device side having first and second circuitry regions, the first circuitry region having greater sensitivity to at least one of mechanical or thermal stress than the second circuitry region. The package also includes conductive members coupled to the bond pads of the substrate, in direct physical contact with the second circuitry region, and not in direct physical contact with the first circuitry region. The package further comprises a first support member coupled to the device side of the semiconductor die and extending toward the substrate and not touching the substrate or a second support member coupled to the substrate. The package also includes a ring on the substrate and encircling the bond pads and a glob top member covering the semiconductor die and a portion of the substrate circumscribed by the ring. The package also includes a mold compound covering the glob top member and the substrate.
