18090838. DOUBLE INTERCONNECTS FOR STITCHED DIES simplified abstract (Intel Corporation)
Contents
DOUBLE INTERCONNECTS FOR STITCHED DIES
Organization Name
Inventor(s)
Abhishek Anil Sharma of Portland OR (US)
Christopher M. Pelto of Beaverton OR (US)
Wilfred Gomes of Portland OR (US)
Tahir Ghani of Portland OR (US)
Anand S. Murthy of Portland OR (US)
DOUBLE INTERCONNECTS FOR STITCHED DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18090838 titled 'DOUBLE INTERCONNECTS FOR STITCHED DIES
The abstract describes stitched dies with double interconnects in an integrated circuit structure.
- First die includes a first device layer, a first plurality of metallization layers, and a first conductive interconnection.
- Second die, separated by a scribe region, includes a second device layer, a second plurality of metallization layers, and a second conductive interconnection.
- Second conductive interconnection extends over the scribe region and is coupled to the first conductive interconnection.
Potential Applications: - Advanced integrated circuit designs - High-density electronic devices - Improved signal transmission in electronic systems
Problems Solved: - Enhancing interconnectivity between separate dies - Increasing efficiency in integrated circuit structures - Facilitating communication between different components
Benefits: - Higher performance in electronic devices - Enhanced reliability in signal transmission - Improved overall functionality of integrated circuits
Commercial Applications: Title: "Innovative Stitched Dies for Enhanced Integrated Circuits" This technology can be utilized in: - Semiconductor manufacturing companies - Electronics industry for consumer devices - Research and development for cutting-edge technologies
Questions about Stitched Dies: 1. How do stitched dies with double interconnects improve the performance of integrated circuits?
- Stitched dies enhance interconnectivity between separate components, leading to better signal transmission and overall efficiency.
2. What are the key advantages of using double interconnects in integrated circuit structures?
- Double interconnects offer increased reliability, improved functionality, and higher performance in electronic devices.
Original Abstract Submitted
Stitched dies having double interconnects are described. For example, an integrated circuit structure includes a first die including a first device layer, a first plurality of metallization layers over the first device layer, and a first conductive interconnection over the first plurality of metallization layers. The integrated circuit structure also includes a second die separated from the first die by a scribe region, the second die including a second device layer, a second plurality of metallization layers over the second device layer, and a second conductive interconnection over the second plurality of metallization layers. The second conductive interconnection extends over the scribe region and is coupled to the first conductive interconnection.
