18090400. ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS simplified abstract (Intel Corporation)
Contents
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS
Organization Name
Inventor(s)
Peumie Abeyratne Kuragama of Chandler AZ (US)
Jieying Kong of Chandler AZ (US)
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18090400 titled 'ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS
The patent application describes a system for cleaning vias, peeling protective film, and roughening the surface of a computer chip using plasma and electrostatic forces.
- The system includes a first electrode that generates plasma to clean vias by etching residual material.
- An electrostatic stage generates a force to peel the protective film from the semiconductor.
- A stage positions the semiconductor while the protective film is peeled, and the plasma roughens the surface after peeling.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Research and development in chip technology
Problems Solved: - Efficient cleaning and preparation of computer chips - Enhanced performance and reliability of semiconductor devices
Benefits: - Improved quality control in chip production - Increased longevity of electronic components - Enhanced functionality of computer chips
Commercial Applications: Title: Advanced Semiconductor Cleaning and Surface Treatment System This technology can be used in semiconductor fabrication facilities to streamline the cleaning and preparation process for computer chips, leading to higher quality and more reliable electronic devices. The market implications include improved efficiency in chip manufacturing and enhanced performance of electronic products.
Questions about the technology: 1. How does the system ensure the thorough cleaning of vias on a computer chip? The system uses plasma generated by the first electrode to etch away residual material in the vias, ensuring a clean surface. 2. What are the advantages of using electrostatic forces to peel protective film from the semiconductor? Electrostatic forces provide a gentle yet effective way to remove the protective film without damaging the semiconductor.
Original Abstract Submitted
This disclosure describes designs and methods for via cleaning, peeling protective film, and providing mild surface roughening and cleaning of a computer chip. A system may include a first electrode configured to generate plasma associated with cleaning vias by etching a residual material associated with smearing; an electrostatic stage configured to generate an electrostatic force associated with peeling the dielectric protective film from the semiconductor; and a stage on which the semiconductor is positioned while the electrostatic stage peels the dielectric protective film from the semiconductor, wherein the plasma is further associated with roughening a surface of the semiconductor after peeling the dielectric protective film from the semiconductor.
