18090394. ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS simplified abstract (Intel Corporation)
Contents
ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS
Organization Name
Inventor(s)
Robert Chroneos, Jr. of Chandler AZ (US)
ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18090394 titled 'ENHANCED ELECTROSTATIC WAFER CHUCK DESIGNS
Abstract: This disclosure describes electrostatic wafer chuck designs for holding and heating semiconductor wafers. An electrostatic wafer chuck may include a metal base; a temperature sensor; and a multi-layer ceramic plate including: a bonding layer; a heater; a first dielectric positioned between the heater and the bonding layer; an electrode to electrostatically hold a semiconductor wafer; a second dielectric positioned between the heater and the electrode; a heat spreader to uniformly distribute heat from the heater to the semiconductor wafer; and a third dielectric positioned between the electrode and the semiconductor wafer; and a temperature sensor may extend through the metal base and at least partially through the multi-layer ceramic plate.
- Simplified Explanation:
The patent application discusses designs for electrostatic wafer chucks used in holding and heating semiconductor wafers.
- Key Features and Innovation:
- Metal base with a temperature sensor - Multi-layer ceramic plate with bonding layer, heater, and dielectrics - Electrode for holding the wafer electrostatically - Heat spreader for uniform heat distribution - Integration of temperature sensor for monitoring
- Potential Applications:
- Semiconductor manufacturing - Wafer testing and processing - Thin film deposition processes
- Problems Solved:
- Ensures secure holding of semiconductor wafers - Provides uniform heating for consistent processing - Monitors temperature for precise control
- Benefits:
- Improved wafer handling and heating - Enhanced process control and efficiency - Higher quality semiconductor products
- Commercial Applications:
Title: Advanced Electrostatic Wafer Chuck Designs for Semiconductor Processing This technology can be used in semiconductor fabrication facilities to enhance wafer handling and heating processes, leading to improved product quality and manufacturing efficiency.
- Questions about Electrostatic Wafer Chuck Designs:
1. How do electrostatic wafer chucks improve semiconductor manufacturing processes? - Electrostatic wafer chucks enhance semiconductor manufacturing by securely holding and uniformly heating wafers, leading to better product quality and process control.
2. What are the key components of an electrostatic wafer chuck? - The key components include a metal base, temperature sensor, multi-layer ceramic plate with bonding layer, heater, dielectrics, electrode, and heat spreader.
Original Abstract Submitted
This disclosure describes electrostatic wafer chuck designs for holding and heating semiconductor wafers. An electrostatic wafer chuck may include a metal base; a temperature sensor; and a multi-layer ceramic plate including: a bonding layer; a heater; a first dielectric positioned between the heater and the bonding layer; an electrode to electrostatically hold a semiconductor wafer; a second dielectric positioned between the heater and the electrode; a heat spreader to uniformly distribute heat from the heater to the semiconductor wafer; and a third dielectric positioned between the electrode and the semiconductor wafer; and a temperature sensor may extend through the metal base and at least partially through the multi-layer ceramic plate.
