18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation)

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

Organization Name

Intel Corporation

Inventor(s)

Suddhasattwa Nad of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Brandon Marin of Gilbert AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Jason Steill of Phoenix AZ (US)

Thomas Sounart of Chandler AZ (US)

Darko Grujicic of Chandler AZ (US)

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18090305 titled 'PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

Simplified Explanation: The patent application describes apparatuses, capacitor structures, assemblies, and techniques related to package substrate embedded capacitors. These capacitors are designed to be at least partially within an opening in an insulative material layer of a package substrate or on a package substrate.

• The capacitor architecture includes a multi-layer capacitor structure with at least two capacitor dielectric layers interleaved with conductive layers.
• The capacitor dielectric layers are within the opening, while one of the conductive layers is on a sidewall of the opening.

Key Features and Innovation:

• Multi-layer capacitor structure embedded within a package substrate.
• Capacitor dielectric layers interleaved with conductive layers for enhanced performance.
• Capacitor structure designed to optimize space and efficiency.

Potential Applications:

• Electronics manufacturing
• Integrated circuit packaging
• Power supply units

Problems Solved:

• Space optimization in electronic devices
• Enhanced capacitor performance
• Improved reliability in electronic components

Benefits:

• Increased efficiency in electronic devices
• Space-saving design
• Enhanced performance and reliability

Commercial Applications: The technology could be utilized in various industries such as consumer electronics, telecommunications, and automotive for improved electronic component integration and performance.

Questions about Package Substrate Embedded Capacitors: 1. How does the design of embedded capacitors within a package substrate improve electronic device performance? 2. What are the potential challenges in manufacturing package substrate embedded capacitors?

Original Abstract Submitted

Apparatuses, capacitor structures, assemblies, and techniques related to package substrate embedded capacitors are described. A capacitor architecture includes a multi-layer capacitor structure at least partially within an opening extending through an insulative material layer of a package substrate or on a package substrate. The multi-layer capacitor structure includes at least two capacitor dielectric layers interleaved with a plurality of conductive layers such that the capacitor dielectric layers are at least partially within the opening and one of the conductive layers are on a sidewall of the opening.