18089963. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Intel Corporation

Inventor(s)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Haobo Chen of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Robert Alan May of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089963 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation:

This patent application discloses a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

• The semiconductor device includes a photonic die and a glass substrate.
• Turning mirrors are used to direct optical signals between the photonic die and the glass substrate.
• Configurations of turning mirrors are provided to enhance signal integrity and manufacturability.

Key Features and Innovation:

• Utilization of turning mirrors to direct optical signals between the photonic die and glass substrate.
• Improved signal integrity and manufacturability through the use of turning mirrors.

Potential Applications:

The technology can be applied in the fields of telecommunications, data transmission, and optical networking.

Problems Solved:

The technology addresses the need for efficient and reliable optical signal transmission between a photonic die and a glass substrate.

Benefits:

• Enhanced signal integrity.
• Improved manufacturability.
• Efficient optical signal transmission.

Commercial Applications:

Title: Semiconductor Device with Turning Mirrors for Optical Signal Transmission This technology can be utilized in the telecommunications industry for high-speed data transmission, optical networking for improved connectivity, and in the manufacturing of advanced electronic devices.

Questions about Semiconductor Device with Turning Mirrors for Optical Signal Transmission:

1. How does the use of turning mirrors improve signal integrity in the semiconductor device? 2. What are the potential applications of this technology in the telecommunications industry?

Original Abstract Submitted

A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.