18089934. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Intel Corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Eric J.M. Moret of Beaverton OR (US)

Robert Alan May of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Tarek A. Ibrahim of Mesa AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Bin Mu of Tempe AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089934 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation: The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

Key Features and Innovation:

• Semiconductor device with photonic die and glass substrate.
• Turning mirrors used to direct optical signals.
• Configurations of turning mirrors improve signal integrity and manufacturability.

Potential Applications: This technology could be used in telecommunications, data centers, and optical networking systems.

Problems Solved: The technology addresses the need for efficient and reliable optical signal transmission between components in semiconductor devices.

Benefits:

• Improved signal integrity.
• Enhanced manufacturability.
• Efficient optical signal transmission.

Commercial Applications: Potential commercial applications include telecommunications equipment, data center infrastructure, and optical networking systems.

Questions about Semiconductor Devices: 1. How do turning mirrors improve signal integrity in semiconductor devices? 2. What are the key benefits of using a photonic die in conjunction with a glass substrate?

Original Abstract Submitted

A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.