18089916. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Intel Corporation

Inventor(s)

Haobo Chen of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Dingying Xu of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089916 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

The semiconductor device described in the patent application includes a photonic die and a glass substrate, with turning mirrors to direct an optical signal between them.

• The electronic device consists of a photonic die and a glass substrate.
• Turning mirrors are utilized to direct the optical signal between the photonic die and the glass substrate.
• Various configurations of turning mirrors are provided to enhance signal integrity and manufacturability.

Potential Applications: - Optical communication systems - Data transmission devices - Photonic integrated circuits

Problems Solved: - Improved signal integrity in semiconductor devices - Enhanced manufacturability of electronic components

Benefits: - Increased efficiency in optical signal transmission - Enhanced reliability of electronic devices - Simplified manufacturing processes

Commercial Applications: Title: "Enhanced Signal Integrity in Semiconductor Devices" This technology can be applied in the telecommunications industry for faster and more reliable data transmission. It can also be used in the development of advanced computing systems for improved performance.

Questions about the technology: 1. How does the use of turning mirrors improve signal integrity in semiconductor devices? 2. What are the potential challenges in implementing this technology in mass production?

Original Abstract Submitted

A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.