18089892. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Intel Corporation

Inventor(s)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Haobo Chen of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Robert Alan May of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089892 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation:

The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

• The semiconductor device includes a photonic die and a glass substrate.
• Turning mirrors are used to direct optical signals between the photonic die and the glass substrate.
• Different configurations of turning mirrors are provided to enhance signal integrity and manufacturability.

Key Features and Innovation:

• Integration of a photonic die and a glass substrate in a semiconductor device.
• Use of turning mirrors to efficiently direct optical signals between components.
• Various configurations of turning mirrors to optimize signal integrity and manufacturing processes.

Potential Applications:

The technology could be applied in telecommunications, data transmission, and optical networking systems.

Problems Solved:

The technology addresses the need for efficient optical signal transmission between components in a semiconductor device.

Benefits:

• Improved signal integrity.
• Enhanced manufacturability.
• Efficient optical signal transmission.

Commercial Applications:

Potential commercial applications include telecommunications equipment, data centers, and optical networking devices.

Questions about Semiconductor Devices: 1. How do turning mirrors improve signal integrity in semiconductor devices? 2. What are the potential applications of integrating a photonic die and a glass substrate in a semiconductor device?

Original Abstract Submitted

A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.