18089871. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Organization Name

Intel Corporation

Inventor(s)

Ziyin Lin of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Bohan Shan of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Haobo Chen of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Robert Alan May of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089871 titled 'OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

Simplified Explanation:

The patent application describes a semiconductor device with a photonic die and a glass substrate, utilizing turning mirrors to direct optical signals between them.

• The semiconductor device includes a photonic die and a glass substrate.
• Turning mirrors are used to direct optical signals between the photonic die and the glass substrate.
• Configurations of turning mirrors are provided to enhance signal integrity and manufacturability.

Key Features and Innovation:

• Utilization of turning mirrors to direct optical signals between components.
• Improved signal integrity and manufacturability through turning mirror configurations.

Potential Applications:

The technology could be applied in telecommunications, data transmission, and optical networking industries.

Problems Solved:

• Enhances signal integrity in semiconductor devices.
• Improves manufacturability of devices.

Benefits:

• Enhanced signal reliability.
• Streamlined manufacturing processes.

Commercial Applications:

Potential commercial applications include telecommunications equipment, data centers, and optical networking devices.

Questions about Semiconductor Devices: 1. How do turning mirrors improve signal integrity in semiconductor devices? 2. What are the potential applications of this technology in the telecommunications industry?

Frequently Updated Research:

Stay updated on advancements in semiconductor device technology and optical networking to leverage the latest innovations in the field.

Original Abstract Submitted

A semiconductor device and associated methods are disclosed. In one example, the electronic device includes a photonic die and a glass substrate. In selected examples, the semiconductor device includes one or more turning mirrors to direct an optical signal between the photonic die and the glass substrate. Configurations of turning mirrors are provided to improve signal integrity and manufacturability.