18089501. FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS simplified abstract (Intel Corporation)
Contents
FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS
Organization Name
Inventor(s)
Zhixin Xie of Chandler AZ (US)
Jung Kyu Han of Chandler AZ (US)
FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18089501 titled 'FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS
Simplified Explanation: The patent application describes a package substrate that includes a substrate with an optical fiber embedded in it, along with a lens that is optically connected to the fiber, specifically a gradient index (GRIN) lens.
- The package substrate includes a substrate and an optical fiber.
- A lens, specifically a gradient index (GRIN) lens, is optically coupled to the optical fiber.
Key Features and Innovation:
- Package substrate design with embedded optical fiber and GRIN lens.
- Optimal optical coupling for enhanced performance.
- Potential for improved optical communication and sensing applications.
Potential Applications:
- Telecommunications industry for high-speed data transmission.
- Medical imaging devices for enhanced clarity and precision.
- Industrial sensors for accurate measurements in harsh environments.
Problems Solved:
- Improved optical coupling efficiency.
- Enhanced signal transmission quality.
- Compact and robust design for various applications.
Benefits:
- Increased data transmission speeds.
- Enhanced image quality in medical devices.
- Reliable and accurate sensor measurements.
Commercial Applications: Optical communication systems, medical imaging equipment manufacturers, sensor technology companies can benefit from this innovative package substrate design.
Questions about Package Substrate: 1. What are the potential advantages of using a GRIN lens in optical fiber applications? 2. How does the design of the package substrate contribute to improved optical performance?
Frequently Updated Research: Ongoing research in the field of optical communication and sensor technology may provide further insights into the applications and benefits of package substrates with GRIN lenses.
Original Abstract Submitted
Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate and an optical fiber in the substrate. In an embodiment, a lens is optically coupled to the optical fiber. In an embodiment, the lens is a gradient index (GRIN) lens.
