18089494. DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract (Intel Corporation)
Contents
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
Organization Name
Inventor(s)
Vinith Bejugam of Chandler AZ (US)
Yonggang Li of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Chandrasekharan Nair of Mesa AZ (US)
Whitney Bryks of Tempe AZ (US)
Gene Coryell of Maricopa AZ (US)
DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18089494 titled 'DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES
- Simplified Explanation:**
The patent application describes a package substrate with a core containing a via opening with sidewalls. A composite layer made of carbon is present along the sidewalls, and the substrate also includes an electrically conductive via within the via opening.
- Key Features and Innovation:**
- Package substrate with a core and via opening - Sidewalls with a composite layer containing carbon - Electrically conductive via within the opening
- Potential Applications:**
- Semiconductor packaging - Integrated circuits - Electronic devices
- Problems Solved:**
- Enhanced electrical conductivity - Improved signal transmission - Increased reliability of electronic components
- Benefits:**
- Better performance of electronic devices - Higher efficiency in signal transmission - Reduced risk of electrical failures
- Commercial Applications:**
The technology can be utilized in the semiconductor industry for manufacturing advanced electronic devices, improving their performance and reliability.
- Questions about Package Substrate:**
1. How does the composite layer with carbon along the sidewalls enhance the package substrate's performance? 2. What are the specific advantages of having an electrically conductive via within the via opening in the package substrate?
Original Abstract Submitted
Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a via opening through the core. In an embodiment, the via opening comprises sidewalls. In an embodiment, a composite layer is provided along the sidewalls, and the composite layer comprises carbon. In an embodiment, the package substrate further comprises a via within the via opening, where the via is electrically conductive.
