18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

Organization Name

Intel Corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Darko Grujicic of Chandler AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Mahdi Mohammadighaleni of Phoenix AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Thomas L. Sounart of Chandler AZ (US)

Marcel Wall of Phoenix AZ (US)

Ravindranath V. Mahajan of Chandler AZ (US)

Rahul N. Manepalli of Chandler AZ (US)

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089476 titled 'THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

The abstract of the patent application describes an electronic package with a package substrate consisting of multiple stacked dielectric layers. The package includes an opening that passes through at least two of the dielectric layers, with a first pad at the bottom of the opening, a capacitor inside the opening, and a second pad above the capacitor.

• Simplified Explanation:

An electronic package with a package substrate made of stacked dielectric layers has an opening that goes through some of the layers, containing a pad at the bottom, a capacitor inside, and another pad on top.

• Key Features and Innovation:

- Electronic package with stacked dielectric layers - Opening passing through layers with pads and a capacitor inside

• Potential Applications:

- Integrated circuits - Electronic devices - Semiconductor packaging

• Problems Solved:

- Efficient use of space in electronic packages - Improved performance of electronic components

• Benefits:

- Enhanced functionality of electronic devices - Space-saving design for compact devices

• Commercial Applications:

Potential commercial applications include the semiconductor industry, electronics manufacturing, and consumer electronics market.

• Questions about Electronic Package:

1. How does the design of the electronic package contribute to space efficiency? 2. What are the advantages of having a capacitor inside the package substrate?

• Frequently Updated Research:

Ongoing research in the field of electronic packaging focuses on improving the performance and reliability of electronic components within compact devices.

Original Abstract Submitted

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of stacked dielectric layers. In an embodiment, the electronic package further comprises an opening into the package substrate, where the opening passes through at least two of the plurality of dielectric layers. In an embodiment, a first pad is at the bottom of the opening, a capacitor is disposed in the opening, and a second pad is over the capacitor.