18089471. THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES simplified abstract (Intel Corporation)

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

Organization Name

Intel Corporation

Inventor(s)

Darko Grujicic of Chandler AZ (US)

Thomas L. Sounart of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Mahdi Mohammadighaleni of Phoenix AZ (US)

Marcel Wall of Phoenix AZ (US)

Rengarajan Shanmugam of Tempe AZ (US)

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18089471 titled 'THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

The abstract of the patent application describes a package core that includes a core substrate made of glass, with a cavity provided in the substrate. A capacitor lines the sidewalls of the cavity, consisting of a first layer, a dielectric layer, and a second layer.

• Package core with core substrate made of glass
• Cavity within the core substrate
• Capacitor lining the cavity sidewalls
• Capacitor composed of first layer, dielectric layer, and second layer

Potential Applications: - Electronic devices - Semiconductor packaging - Integrated circuits

Problems Solved: - Improved packaging for electronic components - Enhanced performance of capacitors

Benefits: - Increased efficiency in electronic devices - Better protection for sensitive components

Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in various electronic devices, leading to improved performance and reliability. It has the potential to revolutionize the semiconductor packaging industry.

Questions about the technology: 1. How does the use of glass in the core substrate benefit the overall performance of the package? Glass provides excellent thermal and electrical properties, making it an ideal material for the core substrate in electronic packaging.

2. What advantages does the capacitor configuration offer in terms of efficiency and reliability? The capacitor configuration with multiple layers enhances the performance and reliability of the electronic components by providing better insulation and stability.

Original Abstract Submitted

Embodiments disclosed herein include a package core. In an embodiment, the package core comprises a core substrate that includes glass. In an embodiment, a cavity is provided into the core substrate. In an embodiment, a capacitor is lining sidewalls of the cavity, and the capacitor comprises a first layer, a dielectric layer over the first layer, and a second layer over the dielectric layer.