18089459. ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
Contents
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES
Organization Name
Inventor(s)
Suddhasattwa Nad of Chandler AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Brandon Marin of Gilbert AZ (US)
Jeremy Ecton of Gilbert AZ (US)
ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18089459 titled 'ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES
Simplified Explanation: The patent application describes an apparatus with an integrated circuit logic device and an integrated circuit power device connected to it. The power device extends beyond the logic device, with vias and conductive contacts facilitating the connection.
- Integrated circuit logic device
- Integrated circuit power device extending laterally beyond logic device
- Vias connecting power device to logic device
- Conductive contacts on the logic device surface
- Enhanced power distribution and connectivity
Potential Applications: 1. Electronics manufacturing 2. Power management systems 3. Circuit design and development
Problems Solved: 1. Efficient power distribution 2. Enhanced connectivity in integrated circuits
Benefits: 1. Improved performance 2. Enhanced reliability 3. Simplified circuit design
Commercial Applications: The technology can be utilized in the development of advanced electronic devices, power systems, and integrated circuits, catering to a wide range of industries such as telecommunications, automotive, and consumer electronics.
Prior Art: Readers can explore prior patents related to integrated circuit design, power distribution, and semiconductor technology to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Stay updated on the latest advancements in integrated circuit design, power management, and semiconductor technology to further enhance the applications of this innovative apparatus.
Questions about the Technology: 1. How does the lateral extension of the power device benefit the overall performance of the integrated circuit? 2. What are the specific advantages of using vias for connecting the power device to the logic device?
Original Abstract Submitted
An apparatus is provided which comprises: an integrated circuit logic device, an integrated circuit power device conductively coupled with a first surface of the integrated circuit logic device, wherein the integrated circuit power device extends laterally beyond a side of the integrated circuit logic device, one or more vias adjacent the side of the integrated circuit logic device extending from contact with the integrated circuit power device to level with a second surface of the integrated circuit logic device opposite the first surface of the integrated circuit logic device, and conductive contacts on the second surface of the integrated circuit logic device. Other embodiments are also disclosed and claimed.
