18089417. INTERCONNECT DEVICE AND METHOD simplified abstract (Intel Corporation)
Contents
INTERCONNECT DEVICE AND METHOD
Organization Name
Inventor(s)
Jung Kyu Han of Chandler AZ (US)
INTERCONNECT DEVICE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18089417 titled 'INTERCONNECT DEVICE AND METHOD
Simplified Explanation: The patent application discloses an electronic device with vertical connections containing a layer of tin between the vertical connections and conductive traces.
Key Features and Innovation:
- Electronic device with vertical connections and tin layer between connections and conductive traces.
- Tin layer used in conjunction with other interface layers in some examples.
- Tin layer used in all vertical connections in selected examples.
Potential Applications: This technology could be applied in various electronic devices such as smartphones, tablets, and computers.
Problems Solved: This technology helps improve the efficiency and reliability of vertical connections in electronic devices.
Benefits:
- Enhanced performance and reliability of electronic devices.
- Improved signal transmission and connectivity.
- Potential cost savings in manufacturing processes.
Commercial Applications: Potential commercial applications include consumer electronics, telecommunications equipment, and industrial machinery.
Prior Art: Readers can start searching for prior art related to this technology in the field of electronic device manufacturing and materials science.
Frequently Updated Research: Stay updated on the latest research in electronic device manufacturing processes and materials science for advancements related to this technology.
Questions about Vertical Connections with Tin Layer: 1. What are the key benefits of using a tin layer in vertical connections in electronic devices? 2. How does the tin layer improve the reliability of signal transmission in electronic devices?
Original Abstract Submitted
An electronic device and associated methods are disclosed. In one example, the electronic device includes vertical connections with a layer including tin between the vertical connections and conductive traces. In selected examples, a layer including tin is used in conjunction with other interface layers. In selected examples, a layer including tin is used in all vertical connections.
