18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)

CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE

Organization Name

Intel Corporation

Inventor(s)

Mohammad Mamunur Rahman of Gilbert AZ (US)

Je-Young Chang of Tempe AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Rahul N. Manepalli of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18088360 titled 'CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE

The abstract of this patent application describes electronic packages with a core made of glass, featuring a channel sealed by a lid.

• Simplified Explanation:

This patent application is about electronic packages that have a glass core with a sealed channel.

• Key Features and Innovation:

- Electronic package with a glass core - Channel in the core sealed by a lid - First and second ends of the channel sealed by the lid

• Potential Applications:

- Electronics industry for packaging components - Aerospace industry for lightweight and durable packages

• Problems Solved:

- Ensures protection of electronic components - Provides a secure and sealed environment for sensitive materials

• Benefits:

- Enhanced durability and protection for electronic components - Sealed channel prevents contamination and damage

• Commercial Applications:

Title: Glass Core Electronic Packages for Secure Component Packaging This technology can be used in various industries such as electronics and aerospace for secure and durable packaging of components.

• Questions about Glass Core Electronic Packages:

1. How does the glass core enhance the durability of electronic packages? 2. What are the potential applications of sealed channels in electronic packaging?

1. A relevant generic question not answered by the article, with a detailed answer: How does the lid seal the channel in the glass core of electronic packages? The lid is designed to fit securely over the channel, creating a sealed environment for the components inside.

2. Another relevant generic question, with a detailed answer: What are the advantages of using glass as the core material in electronic packages? Glass provides a strong and durable structure while also allowing for a sealed channel to protect sensitive components.

Original Abstract Submitted

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a core with a first surface and a second surface opposite from the first surface, and where the core comprises glass. In an embodiment, a channel is disposed into the first surface of the core, and a lid is provided over the channel. In an embodiment, the lid seals the channel between a first end and a second end of the channel.