18087384. HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract (International Business Machines Corporation)

HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION

Organization Name

International Business Machines Corporation

Inventor(s)

Mukta Ghate Farooq of HOPEWELL JCT NY (US)

Arvind Kumar of Chappaqua NY (US)

HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18087384 titled 'HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION

The abstract describes a semiconductor device with voltage regulation, including a chip with a memory device and through-silicon vias (TSVs), a processor on top of the chip, and at least one voltage regulator on top of the chip regulating power to the processor.

• The semiconductor device integrates a memory device, a processor, and voltage regulation in a heterogeneous package.
• The chip contains through-silicon vias (TSVs) for communication between the memory device and the processor.
• The processor communicates with the memory device through a plurality of interconnects.
• At least one voltage regulator is placed on top of the chip to regulate power from the TSVs to the processor.

Potential Applications:

• This technology can be used in high-performance computing systems.
• It can also be applied in mobile devices for efficient power management.

Problems Solved:

• Provides a compact solution for integrating memory, processor, and voltage regulation in a single package.
• Ensures efficient power delivery to the processor for optimal performance.

Benefits:

• Improved performance and power efficiency in semiconductor devices.
• Simplified design and integration process for semiconductor packages.

Commercial Applications:

• This technology can be valuable in the development of advanced computing systems, mobile devices, and IoT applications.

Questions about Semiconductor Device with Voltage Regulation: 1. How does the integration of voltage regulation improve the performance of the semiconductor device? 2. What are the key advantages of using through-silicon vias (TSVs) in this semiconductor package design?

Original Abstract Submitted

Heterogeneous integration semiconductor packages with voltage regulation are described. A semiconductor device can include a chip including a memory device and a plurality of through-silicon-vias (TSVs). The semiconductor device can further include a processor arranged on top of the chip. The processor can be configured to communicate with the memory device via a plurality of interconnects. The semiconductor device can further include at least one voltage regulator arranged on top of the chip. The at least one voltage regulator can be configured to regulate power being provided from the plurality of TSVs to the processor.