18086575. CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract (International Business Machines Corporation)

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

Organization Name

International Business Machines Corporation

Inventor(s)

David Michael Audette of Colchester VT (US)

Grant Wagner of Jericho VT (US)

Steven Paul Ostrander of Poughkeepsie NY (US)

Hubert Harrer of Schoenaich (DE)

Arvind Kumar of Chappaqua NY (US)

Thomas Anthony Wassick of LaGrangeville NY (US)

Matthew Sean Grady of Burlington VT (US)

Sungjun Chun of Austin TX (US)

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST - A simplified explanation of the abstract

This abstract first appeared for US patent application 18086575 titled 'CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

The abstract describes an apparatus with a chip package containing an array of micro-bumps on the chip connection surface, arranged in subarrays with specific pitches. A laminate circuit card with an array of card pads aligned to the micro-bumps is included, along with an interposer connecting the card pads to the micro-bumps.

• Array of micro-bumps on chip connection surface
• Subarrays of micro-bumps with specific pitches
• Laminate circuit card with aligned card pads
• Interposer connecting card pads to micro-bumps
• Potential for including decoupling capacitors in the interposer

Potential Applications: - Semiconductor packaging - High-density electronic devices - Miniaturized electronic components

Problems Solved: - Improved electrical connections in compact devices - Enhanced signal transmission efficiency - Increased packaging density

Benefits: - Higher performance in electronic devices - Reduced footprint of components - Enhanced reliability of connections

Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Density Devices This technology could be utilized in the production of smartphones, tablets, laptops, and other compact electronic devices requiring high-density packaging solutions. The market implications include improved product performance, reduced size and weight, and increased competitiveness in the electronics industry.

Questions about Advanced Semiconductor Packaging Technology: 1. How does this technology improve signal transmission efficiency in electronic devices? 2. What are the potential cost savings associated with using this advanced packaging technology?

Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing techniques to further enhance the performance and reliability of semiconductor packaging technologies. Stay updated on the latest advancements in this field to leverage the full potential of this innovative technology.

Original Abstract Submitted

An apparatus includes a chip package that has a chip connection surface and has an array of micro-bumps on the chip connection surface. The array of micro-bumps includes a plurality of subarrays of micro-bumps. Micro-bumps within each subarray are spaced apart by a chip pitch and the subarrays within the array are spaced apart by a card pitch that is an integer multiple of the chip pitch. The apparatus also includes a laminate circuit card that has a card connection surface that faces the chip connection surface of the chip package and that has an array of card pads adjacent to the card connection surface. The card pads are spaced apart by the card pitch, and each of the card pads is aligned to and electrically connected with a corresponding subarray of micro-bumps. In some embodiments, an interposer connects the card pads to the micro-bumps, and may include decoupling capacitors.