18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation)

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

Organization Name

Intel Corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18086293 titled 'GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

The abstract describes an electronic system with a glass core layer containing an active component die and a discrete passive component, a mold layer with another active component die, and a buildup layer connecting them all.

• Glass core layer with active component die and discrete passive component
• Mold layer with active component die
• Buildup layer connecting all components
• Electrically conductive interconnect in the buildup layer
• Top surface active component die connected to mold layer active component die

Potential Applications: - Integrated circuits - Electronic devices - Semiconductor manufacturing

Problems Solved: - Efficient interconnection of multiple components - Space-saving design - Enhanced electrical connectivity

Benefits: - Improved performance - Compact design - Simplified manufacturing process

Commercial Applications: Title: "Advanced Electronic System for Integrated Circuits" This technology can be used in the production of various electronic devices, such as smartphones, tablets, and computers, to enhance their performance and functionality. The market implications include increased demand for high-performance electronic components.

Prior Art: Readers can explore prior art related to integrated circuits, semiconductor packaging, and electronic system design to understand the evolution of this technology.

Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further improve the efficiency and reliability of electronic systems like the one described in this patent application.

Questions about Electronic Systems: 1. How does the glass core layer contribute to the overall performance of the electronic system? The glass core layer provides a stable and reliable base for the active component die and passive components, ensuring efficient electrical connectivity.

2. What are the key advantages of using a mold layer in the electronic system design? The mold layer allows for the integration of additional active component dies in a compact space, enhancing the functionality of the electronic system.

Original Abstract Submitted

An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer having a glass core layer active component die disposed in a cavity and a discrete passive component disposed in another cavity; a mold layer including a mold layer active component die disposed in the mold layer; and a buildup layer contacting a top surface of the glass core layer and a bottom surface of the mold layer. The buildup layer includes electrically conductive interconnect connecting the glass core layer active component die, the discrete passive component, and the mold layer active component die. The top surface of the component die is electrically connected to the mold layer active component die.