18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

Organization Name

Intel Corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18086265 titled 'LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

The abstract describes an electronic system with a substrate containing a glass core layer and a cavity, a glass core layer active component die, buildup layers, and a mold layer with an active component die. The system also includes electrically conductive interconnects and a top surface active component die connected to the mold layer active component die.

• Glass core layer with a cavity for housing active component die
• Buildup layers for electrical connectivity
• Mold layer with active component die
• Electrically conductive interconnects for connectivity
• Top surface active component die for overall system functionality

Potential Applications: - Electronic devices - Semiconductor industry - Integrated circuits

Problems Solved: - Providing electrical connectivity in a compact system - Enhancing overall system functionality

Benefits: - Improved performance - Space-saving design - Enhanced connectivity

Commercial Applications: - Consumer electronics - Telecommunications industry - Automotive sector

Prior Art: Prior art related to this technology may include patents or research on electronic systems with similar design elements and functionalities.

Frequently Updated Research: Research on advancements in semiconductor technology and electronic packaging methods may be relevant to this technology.

Questions about the technology: 1. How does the glass core layer contribute to the overall functionality of the electronic system? 2. What are the potential challenges in integrating the mold layer with the active component die?

Original Abstract Submitted

An electronic system includes a substrate and a top surface active component die. The substrate includes a glass core layer including a cavity formed through the glass core layer; a glass core layer active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer; a second buildup layer contacting a second surface of the glass core layer; and a mold layer contacting a surface of the first buildup layer. The mold layer includes a mold layer active component die disposed in the mold layer, and the first buildup layer includes electrically conductive interconnect providing electrical continuity between the glass core layer active component die and the mold layer active component die. The top surface active component die is attached to the top surface of the substrate and electrically connected to the mold layer active component die.