18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

Organization Name

Intel Corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Kyle Jordan Arrington of Gilbert AZ (US)

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18086232 titled 'GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

The abstract describes an electronic system with a glass core layer containing a cavity for active component dies, buildup layers, and solder bumps for interconnections.

• Glass core layer with cavity for active component dies
• Buildup layers for electrical interconnects
• Solder bumps for connections to active component dies
• Substrate as the base for the electronic system
• Integration of active component dies within the glass core layer

Potential Applications: - Advanced electronic devices - Microelectronics - Semiconductor industry

Problems Solved: - Enhanced integration of active component dies - Improved electrical interconnects - Compact electronic systems

Benefits: - Higher performance in electronic devices - Increased reliability and durability - Space-saving design

Commercial Applications: Title: "Innovative Electronic System for Enhanced Performance" This technology can be used in: - Consumer electronics - Medical devices - Aerospace industry

Prior Art: Research on glass core layers in electronic systems Studies on active component die integration techniques

Frequently Updated Research: Ongoing developments in microelectronics Advancements in semiconductor technology

Questions about Glass Core Electronic System: 1. How does the glass core layer enhance the performance of the electronic system? The glass core layer provides a stable and reliable platform for integrating active component dies, improving overall system performance.

2. What are the potential challenges in implementing this electronic system in commercial applications? Some challenges may include optimizing the manufacturing process for mass production and ensuring compatibility with existing electronic systems.

Original Abstract Submitted

An electronic system includes a substrate that includes a glass core layer including a cavity formed through the glass core layer; at least one active component die disposed in the cavity; a first buildup layer contacting a first surface of the glass core layer and a first surface of the at least one active component die, wherein the first buildup layer includes electrically conductive interconnect contacting the at least one active component die and extending to a first surface of the substrate; a second buildup layer contacting a second surface of the glass core layer and a second surface of the at least one active component die; and one or more solder bumps on a second surface of the substrate and contacting the second surface of the at least one active component die.