18086150. Silicon (Si) Dry Etch for Die-to-Wafer Thinning simplified abstract (Applied Materials, Inc.)
Contents
Silicon (Si) Dry Etch for Die-to-Wafer Thinning
Organization Name
Inventor(s)
Guan Huei See of Singapore (SG)
ChangBum Yong of Singapore (SG)
Prayudi Lianto of Singapore (SG)
Arvind Sundarrajan of Singapore (SG)
Silicon (Si) Dry Etch for Die-to-Wafer Thinning - A simplified explanation of the abstract
This abstract first appeared for US patent application 18086150 titled 'Silicon (Si) Dry Etch for Die-to-Wafer Thinning
Simplified Explanation: The patent application describes a method of thinning a die engaged with a substrate using dry etching with a plasma containing fluorine to selectively remove the top surface of the die relative to the substrate.
Key Features and Innovation:
- Thinning a die engaged with a substrate using dry etching with a plasma containing fluorine.
- Selectively removing the top surface of the die relative to the substrate.
Potential Applications: This technology could be used in semiconductor manufacturing processes to thin dies for various electronic devices.
Problems Solved: This technology addresses the need for precise and selective thinning of dies in semiconductor manufacturing.
Benefits:
- Improved control over die thinning process.
- Enhanced performance of electronic devices.
- Increased efficiency in semiconductor manufacturing.
Commercial Applications: Title: Advanced Die Thinning Technology for Semiconductor Manufacturing This technology could be utilized in the production of smartphones, tablets, and other electronic devices, enhancing their performance and reliability.
Prior Art: Readers can start searching for prior art related to this technology in the field of semiconductor manufacturing processes and die thinning techniques.
Frequently Updated Research: Stay updated on the latest advancements in dry etching techniques and plasma technology for semiconductor manufacturing processes.
Questions about Die Thinning Technology: 1. What are the key benefits of using dry etching with a plasma containing fluorine for thinning dies in semiconductor manufacturing? 2. How does this technology improve the performance of electronic devices compared to traditional die thinning methods?
Original Abstract Submitted
A method of thinning a die engaged with a substrate is disclosed, utilizing dry etching of a top surface of the die with a plasma comprising fluorine to selectively remove the top surface of the die relative to a top surface of the substrate.
