18085284. PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT simplified abstract (QUALCOMM Incorporated)
Contents
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
Organization Name
Inventor(s)
Youmin Yu of Escondido CA (US)
Guoping Xu of San Diego CA (US)
Nader Nikfar of San Diego CA (US)
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18085284 titled 'PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
The abstract describes a package that includes a substrate, a first integrated device connected to the substrate, and a lid structure attached to the substrate. The lid structure contains a compartment with a thermal interface material that connects to the integrated device and the inner surfaces of the compartment.
- The package includes a substrate with at least one dielectric layer and multiple interconnects.
- A first integrated device is linked to the substrate.
- A lid structure is affixed to the substrate, housing a compartment with a thermal interface material.
- The thermal interface material connects the integrated device to the surfaces of the compartment.
- The package design aims to enhance thermal management and protect the integrated device.
Potential Applications: - Electronic devices requiring efficient thermal management. - High-performance computing systems. - Aerospace and automotive electronics.
Problems Solved: - Improving thermal dissipation in electronic devices. - Protecting integrated devices from overheating.
Benefits: - Enhanced thermal performance. - Increased reliability of integrated devices. - Extended lifespan of electronic components.
Commercial Applications: Title: "Advanced Thermal Management Package for Electronics" This technology can be utilized in various industries such as consumer electronics, telecommunications, and automotive sectors. It can improve the reliability and performance of electronic devices, leading to increased customer satisfaction and potentially reducing maintenance costs.
Questions about the technology: 1. How does the thermal interface material improve the performance of the integrated device?
The thermal interface material facilitates efficient heat transfer, preventing overheating and enhancing the overall performance of the integrated device.
2. What are the key advantages of using a lid structure with a thermal interface material in electronic packaging?
The lid structure with a thermal interface material helps in effective thermal management, ensuring the longevity and reliability of the integrated devices.
Original Abstract Submitted
A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. The substrate includes at least one dielectric layer and a plurality of interconnects.
